IDS uEye ACP Series Provides Added Customisation Options for Board-level Cameras

Cost-effective from lot size one, readily available, highly variable

As versatile as the IDS industrial camera families are, sometimes customer requirements are so particular that a customised development would be desirable. However, this often only makes sense for larger quantities. For this reason, the company has developed the uEye ACP series: its modular design principle allows for a vast range of camera variants. The online configurator helps to put together unusual models that are available from stock. True to the philosophy: be uncompromisingly happy instead of making compromises.

IDS Imaging Development Systems has developed all essential camera components for the uEye ACP series – such as sensor boards, connectors and lens holders – as standard modules that can be freely combined. The range includes USB3 and GigE Vision interfaces, connector boards with various connector options, flex cables and a wide range of image sensors from 0.5 to 20 MP.

Customised board-level cameras are available off the shelf in quantities as low as one, without the usual development cycles of individual projects. Furthermore, customers have the option of receiving the camera fully assembled or as individual components. As is customary for IDS, careful testing before shipment and quality “Made in Germany” are a matter of course in both cases.

In addition to the uEye ACP product line, the industrial camera manufacturer also takes on customised development projects. On request, an experienced team carries out everything that is technically possible, from individual design to adaptations of the housing, board electronics and connector configuration, as well as software adaptations.

More information: www.en.ids-imaging.com/acp-cameras.html

Hot this week

Infineon releases 12 kW high-density power supply unit (PSU) reference design for AI data centers and servers

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) is...

How eSIM Technology Simplifies IoT Device Management

The Internet of Things (IoT) continues to expand rapidly,...

COMAU JOINS THE SPRINT PROJECT TO HELP DEVELOP SODIUM-ION BATTERIES FOR STATIONARY USE

Comau has joined the SPRINT project to design and...

Velocity Global Rebrands as Pebl, Introducing AI-First Global Hiring Platform

Velocity Global, creator of the Employer of Record (EOR)...

WEG releases Integrated Annual Report, reinforcing its commitment to sustainability

WEG, global leader in high-efficiency motors, has released its...

How eSIM Technology Simplifies IoT Device Management

The Internet of Things (IoT) continues to expand rapidly,...

Velocity Global Rebrands as Pebl, Introducing AI-First Global Hiring Platform

Velocity Global, creator of the Employer of Record (EOR)...

WEG releases Integrated Annual Report, reinforcing its commitment to sustainability

WEG, global leader in high-efficiency motors, has released its...

AI and Agility Top the List of Critical Trends that Will Define Manufacturing Competitiveness in 2026

Xometry, Inc. (NASDAQ:XMTR), the global AI-powered marketplace connecting buyers...

Renishaw introduces powerful MODUSTM IM Equator intelligent metrology software

Renishaw, a global leader in engineering technologies, will introduce...

Leading the Future of AI Mobility: XPENG Showcases Its Latest Technology Breakthroughs at IAA Mobility 2025

XPENG, a leading China-based high-tech company, unveiled its latest...

Related Articles

Popular Categories