BOLD Laser Automation Launches Cost-Effective Precision Measurement Systems

Bold Laser Automation, Inc., a developer of advanced laser processing and metrology systems, today announced the launch of two precision measurement systems engineered to deliver fast, accurate, and repeatable non-contact measurements for sensitive materials in cleanroom and high-tech manufacturing environments. The new LJS1820S Manual 3D Static Measurement System and CDM1820S Confocal Differential Static Measurement System provide manufacturers with cost-effective, operator-friendly tools for critical quality control and contamination detection applications.

“Many manufacturers struggle to achieve high-accuracy thickness and surface measurements without resorting to overly complex or costly systems,” said Todd Lizotte, CEO and co-founder of Bold Laser Automation. “At BOLD, we believe in delivering high performance without overengineering—systems that are designed to solve real problems without turning into million-dollar solutions.”

The LJS1820S system is purpose-built for precision 3D contamination detection and surface analysis. Equipped with dual Keyence LJ-S series snapshot sensors, the system performs full-area 3D inspections that reveal particulate contamination, surface defects, and embedded residues — ideal for cleanroom and advanced materials manufacturing. A static, ESD-safe platform with an optional footswitch for hands-free data capture enhances ease of use and repeatability.

Complementing this, the CDM1820S system is optimized for precision thickness measurement of thin films, foils, glass, fabrics, and sensitive materials (from 10 microns up to 35 mm, based on the sensor). Integrated with dual Keyence CL Series confocal sensors, the CDM1820S enables non-contact, high-resolution measurements with real-time display and configurable reporting. Like the LJS1820S, it features a customizable user interface and an optional footswitch-activated acquisition system.

“These systems were designed with practicality in mind—manual positioning, intuitive interfaces, and data exports for QA/QC reporting are all standard,” added Lizotte. “The CDM1820S system sets a new benchmark for manual thickness measurement systems where traceability, accuracy, and operator safety are top priorities.”

Key uses include:

• The ability to verify thickness for applications involving carbon fiber composites, plastic films, ultra-thin glass (250+ microns), web, textiles, food packaging, and aerospace and automotive components.

• The ability to randomly take witness samples or punch coupons for offline measurements, a critical task for both quality assurance and material savings.

Both platforms are U.S.-built and engineered to meet industry and cleanroom electrical and safety standards. They feature ergonomic designs, robust mechanical enclosures, integrated computer systems, and clear documentation to support installation, operation, and compliance workflows.

The included UI and reporting tools allow for seamless integration into existing QA/QC processes. The introduction of the LJS1820S and CDM1820S systems underscores Bold Laser Automation’s commitment to delivering economical, high-performance solutions tailored to the evolving needs of modern manufacturing environments.

For more information visit: boldlaserautomation.com

Hot this week

Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System

Siemens and NVIDIA today announced a significant expansion of...

Cohesity Recruits Julien Mousqueton as Field CISO for Europe to Drive Cyber Resilience and Innovation

Cohesity, a leader in AI-powered data security and management,...

YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium

YINCAE Advanced Materials, a leading supplier of high-performance materials...

Sony Outlines Vision for 5G eRedCap as the Next Step in IoT Connectivity

Sony Semiconductor Israel (Sony) today announced its long-term vision...

Siemens and NVIDIA Expand Partnership to Build the Industrial AI Operating System

Siemens and NVIDIA today announced a significant expansion of...

YINCAE to Showcase Innovative Products at Wafer-Level Packaging Symposium

YINCAE Advanced Materials, a leading supplier of high-performance materials...

Sony Outlines Vision for 5G eRedCap as the Next Step in IoT Connectivity

Sony Semiconductor Israel (Sony) today announced its long-term vision...

CELUS and AGS Devices Simplify Electronics Design and Procurement Processes

CELUS, developer of the leading AI-assisted electronics design platform...

How businesses will actually use AI in 2026

After two years of experimentation, pilots and hype, businesses...

Driving innovation across UK industry

Southern Manufacturing & Electronics 2026 is set to host...

Related Articles

Popular Categories