Teledyne Adimec and Teledyne DALSA, Teledyne Technologies [NYSE: TDY] companies within Teledyne Vision Solutions, will demonstrate a new Sony® IMX927-based 100 Gbit/s imaging platform at VISION Stuttgart, taking place from 6 to 8 October 2026 in Stuttgart, Germany. Developed to address the growing throughput demands of advanced semiconductor inspection and metrology, the platform provides a complete imaging path from sensor to host processing. Visitors can see the platform in action at the Teledyne Vision Solutions booth (Hall 8, Booth 8B10).
The platform combines Teledyne Adimec’s S-105A110 camera, with Teledyne DALSA’s upcoming Xtium™3-QSFP28 frame grabber. Based on Sony’s IMX927 image sensor, the 105 MP resolution camera delivers 110 frames per second and features a CoaXPress® over fiber interface. Together, the camera and frame grabber form a complete 100 Gbit/s imaging platform for high-bandwidth image acquisition.
The continued growth of AI and high-performance computing is accelerating demand for advanced semiconductor packaging. As devices become larger and more complex, inspection systems must cover larger fields of view, capture more detail, and maintain throughput without compromising image quality. This increases the need for high-resolution sensors, faster camera interfaces, and scalable host-side data handling.
The S-105A110 camera is engineered for high-resolution, high-throughput applications where sustained data rates, image quality, and thermal stability are critical. Its advanced thermal management supports stable operation, while factory-calibrated image correction helps deliver consistent image quality from the start.
The Xtium3-QSFP28 frame grabber complements the camera with dual QSFP28 connectivity, PCIe Gen 4 host interface support, and data-forwarding capability for scalable image-processing architectures. Together, the platform helps developers and system integrators handle very high data rates while reducing integration complexity.
Prototype units are expected to be available for evaluation in Q1 2027.
Teledyne Adimec acknowledges the European ENTERTAIN project for its contribution to making the development of these 100 Gbit/s imaging platforms possible.
