Koh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany. Visitors can explore Koh Young’s latest advances in electronics manufacturing and semiconductor packaging at Booth A2.377 for Surface Mount Technology (SMT) and software innovations, and at Booth B1.213 for advanced packaging and semiconductor metrology.
Exhibition Highlights
Koh Young will introduce new software, algorithms, and inspection capabilities combining True 3D measurement with AI and automation to enhance quality, efficiency, and process control.
- THT Inspection – New algorithms for Through-Hole and press-fit joints ensure reliable inspection in mixed-technology assemblies, reducing escapes and costly rework.
- KSMART – A data analytics platform that turns inspection results into actionable insights, enabling real-time optimization and continuous improvement toward the Smart Factory.
- KAP (Koh Young Auto-Programming) – AI-assisted auto-programming that generates optimized inspection programs automatically, reducing setup time from hours to minutes.
- Smart Review – An intelligent defect review system that filters false calls and highlights real defects, minimizing operator workload and accelerating corrective action.
- KY8030-3 – Equipped with a telecentric lens and 8-megapixel camera for sharper solder paste measurement and improved printing accuracy.
- Zenith 2 – Enhanced with side-view cameras that deliver more comprehensive inspection coverage, catching hidden or partially obscured defects that traditional AOI systems miss.
- Zenith UHS (Ultra High Speed) – Now capable of inspecting components up to 60 mm in height, supporting reliable quality control for tall devices used in EVs, power electronics, and data infrastructure.
Technology Showcase
- KY8030-3 High-speed True 3D Solder Paste Inspection (SPI) with new telecentric optics and 8 MP resolution, providing sharper images and more consistent solder paste quality.
- aSPIre3 Maximum-precision True 3D SPI solution for fine-pitch and advanced designs.
- Zenith Alpha HS+ High-speed True 3D Automated Optical Inspection (AOI) system balancing inspection speed and accuracy for high-volume SMT production.
- Zenith UHS The fastest True 3D AOI platform, now supporting tall component inspection up to 60 mm, ideal for EV, power, and infrastructure applications.
- Zenith 2 AOI platform with enhanced side-view cameras for comprehensive coverage, capable of detecting defects on hidden and obscured components.
- Neptune C+ Inspection of transparent and conformal coating materials using patented LIFT (Laser Interferometry for Fluid Tomography) technology.
- Meister D+ Advanced semiconductor metrology system with sub-micron accuracy, designed for reflective and complex surfaces in advanced packaging.
Visit Koh Young
Experience Koh Young’s True 3D inspection, AI-driven software, and intelligent optimization tools in action. Visit Booth
- 377 (Productronica – SMT & software)
- 213 (SEMICON Europa – advanced packaging & semiconductor)
Learn more at www.kohyoung.com.
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