Infineon Collaborates with Typhoon HIL to Accelerate Development of xEV Power Electronic Systems Using Real-time Hardware-in-the-loop Platform

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced a collaboration with Typhoon HIL, a leading provider of Hardware-in-the-Loop (HIL) simulation solutions, to provide automotive engineering teams with a fully-integrated, real-time development and test environment for key elements of xEV powertrain systems. Customers working with Infineon’s AURIX™ TC3x/TC4x automotive microcontrollers (MCUs) can now use a complete HIL simulation and test solution using Typhoon’s HIL simulator for ultra-high fidelity motor drive, on-board charger, BMS, and power electronics emulation, which provides a plug-and-play interface via the Infineon TriBoard Interface Card.  

“Developers of xEV components including motor drives, battery management systems, on-board chargers, and DC-DC converters increasingly rely on Controller Hardware-in-the-Loop (C-HIL), on top of Software-in-the-Loop (SIL) and simulation-based approaches, to quickly achieve results and more rapidly iterate in both prototyping and test cycles,” said Christopher Thibeault, Director of Partnership & Ecosystem Management Automotive Americas, Infineon Technologies. “With Typhoon’s proven real-time HIL platform, our AURIX customers can access a design and test environment that will help bring their automotive solutions based on dependable electronics to market faster.”

The solution offered by Infineon and Typhoon HIL includes any of several Typhoon HIL Simulators for real-time digital testing, a suite of testbed hardware and software tools, and the Infineon TriBoard Interface Card, which supports Infineon AURIX TC3xx and TC4xx evaluation boards and plugs directly into a single row of DIN41612 connectors on the front panel of the HIL Simulator. The solution streamlines validation workflows, expedites design and testing processes, and reduces development costs and complexity for customers. Typhoon HIL also offers an “Automotive Communication Extender” product for its HIL Simulator solution based on an AURIX TC3xx processor, which will provide an enhanced  communication interface that allows customers to connect to a larger number of heterogenous ECUs under test via CAN, CAN FD, LIN, and SPI protocols.

“We are excited to partner with a leader in the automotive integrated circuits market, to provide MCU developers with a platform for development and testing of AURIX-based controllers before hardware design is completed,” said Petar Gartner, Director of HIL Solutions, Typhoon HIL. “Our joint customers gain a competitive edge by accelerating their design and test operations while reducing costs, which ultimately translates to market advantage.  We look forward to this ongoing collaboration with Infineon.”

Availability

The TriBoard Interface Card is available today at www.infineon.com/cms/en/partners/design-partners/typhoon-hil. For more information on using Typhoon HIL’s platform with Infineon AURIX microcontrollers, visit www.typhoon-hil.com/products/hil-interfaces/hil-infineon-interface-cards.

About Typhoon HIL

Typhoon HIL is the market leader in ultra-high-fidelity Hardware-in-the-Loop (HIL) solutions, that accelerate innovation in industrial electronics, e-Mobility, and grid modernization applications. Our vertically integrated solutions unlock value stacking, enabling customers to accelerate time to market while reducing costs and enhancing quality. Committed to technical and business excellence, our mission is to engineer and promote environmentally sustainable power technologies that scale. Further information is available at www.typhoon-hil.com.

Hot this week

SICK’S Flexi Soft Controller Enables Safety Systems Technology to Create One of UK’s Largest Span Configurable Safety Projects

Sensor specialist SICK supplied bespoke machinery safety solutions company...

eschbach Unveils Seqonis, the Next Evolution of Its Intelligent Operations Platform

eschbach today announced that its flagship enterprise software platform,...

Software Improvement Group closes the AI code blind spot with Sigrid®

Software Improvement Group (SIG) today launches AI Code Governance,...

Lantek signs agreement to develop technological campus for smart industry in Spain

Lantek, a multinational technology company specialising in software and...

FANUC proves collaboration is key to automation success at Smart Factory Expo

Factory automation experts FANUC UK will highlight the benefits...

eschbach Unveils Seqonis, the Next Evolution of Its Intelligent Operations Platform

eschbach today announced that its flagship enterprise software platform,...

Software Improvement Group closes the AI code blind spot with Sigrid®

Software Improvement Group (SIG) today launches AI Code Governance,...

Lantek signs agreement to develop technological campus for smart industry in Spain

Lantek, a multinational technology company specialising in software and...

FANUC proves collaboration is key to automation success at Smart Factory Expo

Factory automation experts FANUC UK will highlight the benefits...

AI Boom Exposes Data Centre Confidence Crisis

As artificial intelligence (AI) demand accelerates, new research from Fluke...

Shibaura Machine brings high-precision injection moulding to Interplas 2026

Shibaura Machine will demonstrate its latest plastics and rubber...

Humanoid Robots Show Clearer ROI, but Commercial Success Depends on Effective Output

Humanoid robots are moving from prototype validation toward early...

Related Articles

Popular Categories