Teledyne e2v Expands 3D Imaging Portfolio with New Perciva ToF Camera

Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces Perciva™ ToF, its new industrial grade 3D Time-of-Flight (ToF) camera. Designed for reliable operation in demanding environments, Perciva ToF combines high-performance depth sensing, on-camera processing, and flexible integration for a wide range of applications, including logistics, robotics, inspection, and surveillance.

Powered by Teledyne e2v’s Hydra3D™+ CMOS image sensor, Perciva ToF combines 832 x 600 pixel resolution with patented HiRho technology, which increases FFxQE at near-infrared wavelengths while maintaining excellent MTF and modulation contrast. Its 10 µm three-tap pixel architecture captures more light, enabling longer operating distances, reliable detection of low-reflectivity materials, and motion-artifact-free imaging of fast-moving objects. This enables accurate, dependable 3D measurements, even in high-speed industrial applications.

Perciva ToF has been engineered to deliver robust performance in challenging conditions, including varying outdoor illumination and interference caused by other systems, without requiring interconnecting cameras. Factory calibration and embedded processing simplify system integration by providing depth maps and point cloud data directly through the camera’s GigE interface.

The camera’s industrial design and embedded intelligence enable developers and system integrators to deploy 3D vision capabilities more quickly in applications requiring reliable depth measurement and real-time performance.

See Perciva ToF in action at VISION in Stuttgart, Germany, from October 6-8, 2026. Visit us in Hall 8, Booth 8B10, or contact us online for more information.

Documentation and samples are available upon request.

Hot this week

Swindon Silicon Systems to showcase energy-efficient custom silicon at electronica 2026

Swindon Silicon Systems will exhibit at electronica 2026, inviting...

Kontron AIS and Ecoprogetti Enter into Strategic Collaboration for Integrated Solar Module Manufacturing

Kontron, a leading global provider of IoT/Embedded Computing technology...

Bosch Strengthens Semiconductor Business with Dedicated Division

Stuttgart, Germany – They may be small components, but...

Hexnode appoints Ben Roberts as Sales Director for Channels and Alliances in the UK

Hexnode, the enterprise software division of Mitsogo Inc., today...

Microchip Brings EtherCAT® and TSN Networking Solutions to Its Power-Efficient PolarFire® FPGA Platform

As industrial systems evolve to support AI-enabled automation, robotics...

Swindon Silicon Systems to showcase energy-efficient custom silicon at electronica 2026

Swindon Silicon Systems will exhibit at electronica 2026, inviting...

Kontron AIS and Ecoprogetti Enter into Strategic Collaboration for Integrated Solar Module Manufacturing

Kontron, a leading global provider of IoT/Embedded Computing technology...

Bosch Strengthens Semiconductor Business with Dedicated Division

Stuttgart, Germany – They may be small components, but...

Hexnode appoints Ben Roberts as Sales Director for Channels and Alliances in the UK

Hexnode, the enterprise software division of Mitsogo Inc., today...

Kontron relies on NOFFZ for the automated testing of its 5G communication modules

Kontron, a leading global provider of IoT/embedded computer technology...

Alps Alpine to Showcase Advanced Industrial Solutions at electronica 2026

Alps Alpine today announced its participation in electronica 2026,...

Leuze integrates cybersecurity into industrial sensor development to meet CRA requirements

The Cyber Resilience Act introduces new requirements for connected...

Related Articles

Popular Categories