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2026: The year every team gets its own “AI intern”
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2026: The year every team gets its own “AI intern”
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Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions
January 15, 2026
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IDTechEx Investigates: Could New Nuclear Feed Power-Hungry Data Centers?
January 15, 2026
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O’Reilly launches Verifiable Skills for precisely targeted competency-based learning
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Innodisk Achieves IEC 62443-4-1 Certification to Standardize Secure Development for Edge AI and Industrial Solutions
January 15, 2026
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Automation Nation: Why robotics must power the future of UK manufacturing
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O’Reilly launches Verifiable Skills for precisely targeted competency-based learning
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Ethernet Controller Market Landscape, Advancing Intelligent Networking and Next-Gen Connectivity Solutions by 2032
June 19, 2025
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December 16, 2025
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2026: The year every team gets its own “AI intern”
January 15, 2026
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O’Reilly launches Verifiable Skills for precisely targeted competency-based learning
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Posts by Rebecca Lee
Rebecca Lee
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A.i
54% of cybersecurity professionals believe attackers will benefit more from AI than defenders, reveals CIISec report
Rebecca Lee
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November 11, 2024
Electronics
Southern Manufacturing & Electronics 2025 Show Preview: Broanmain Plastics, Stand C195
Rebecca Lee
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November 8, 2024
CyberSecurity
New high-performance Microcontroller: Infineon Launches AURIX™ TC4Dx
Rebecca Lee
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November 8, 2024
IIoT
Advantech Unveils Arm®SystemReady IR certified TPC-100W Series Panel PC set to revolutionise Industrial IoT
Rebecca Lee
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November 8, 2024
A.i
Murugan Govindasamy Joins Boon Logic as Strategic Advisor
Rebecca Lee
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November 7, 2024
Electronics
Delta Launches Compact, Intelligent Power Management Smart PDU I-Type for Telecom Operators and Data Centers
Rebecca Lee
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November 7, 2024
Aerospace
Apex Dynamics praised for “seamless and transparent” integration of AFR gearboxes and rack and pinion sets by Cambridge Dynamics
Rebecca Lee
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November 7, 2024
Asia Pacific
Focusing on Southeast Asia, WEPACK ASEAN 2024 Creates a Brand-new Feast of Packaging Industry
Rebecca Lee
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November 7, 2024
3D Printing
Teledyne DALSA and Wickon Hightech Announce Strategic Collaboration to Revolutionize 3D Scanning Technology
Rebecca Lee
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November 7, 2024
Communications
SICK and CoreTigo Partner on IO-Link Wireless
Rebecca Lee
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November 7, 2024
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