YINCAE Advanced Materials, a leading supplier of high-performance materials for advanced semiconductor packaging, will showcase its latest wafer-level packaging solutions at the Wafer-Level Packaging Symposium, taking place February 17–19, 2026, in San Francisco, California, USA.
At the event, YINCAE will highlight TM 150LM liquid metal thermal interface material in combination with LA 150 rubber sealant, a material system designed to deliver low thermal impedance while significantly reducing mechanical stress on chips. This solution is well suited for wafer-level and advanced packaging applications requiring both thermal efficiency and mechanical compliance. TM 150LM with LA 150 has successfully passed five reflow cycles at 260 °C with no observable change in material performance, demonstrating excellent thermal and mechanical reliability.
YINCAE will also feature UF 66L, an optical-grade underfill developed for silicon photonics applications. UF66L provides high optical clarity, stable mechanical properties, and robust reflow reliability. The material has passed five reflow cycles at 260 °C without any performance degradation, meeting the stringent requirements of silicon photonics and optoelectronic packaging.
“These materials reflect YINCAE’s continued focus on enabling advanced wafer-level and photonics packaging with proven reliability” said Dr. Wusheng Yin, CTO at YINCAE. “Our solutions are designed to support customers addressing thermal management, stress reduction, and high-temperature assembly challenges.”
YINCAE invites conference attendees to visit the YINCAE Booth to learn more about its wafer-level packaging materials and to discuss application-specific solutions.
For more information on TM 150LM, UF 66L, or YINCAE’s full product portfolio, please contact info@yincae.com or visit yincae.com