ASMPT, the world’s leading supplier of hardware and software for semiconductor and electronics production, presents the multi-purposes precision pick & place solution NUCLEUS XLplus. ASMPT thus underlines the growing importance of advanced packaging in generative AI and high-performance computing (HPC).
“As the AI industry continues to push the boundaries of computing power, the demand for HPC and AI chips have become a driving force behind innovations in advanced packaging technologies,” explains Nelson Fan, Vice President of Business Development for Advanced Packaging at ASMPT. “With NUCLEUS XLplus, we are supplying exactly the right solution to enable the digital world.”
Fan-out packaging is becoming a key technology for high volume semiconductor manufacturing in the AI era. With the NUCLEUS series from ASMPT, for 2.5D, fan-out and embedded packaging as well as for complete wafer-level and panel-level assembly, ASMPT is addressing to this trend. NUCLEUS series offer more performance and additional functions in a more cost-effective manner.
Versatile in use
The NUCLEUS XLplus is the innovative ASMPT platform for Fan-Out Panel-Level Packaging (FOPLP). Developed according to SEMI 3D20 standard, it offers exceptional accuracy in SiP bonding and flexibility in the fan-out process. Key features of the NUCLEUS XLplus include:
- Support for a wide range of package configurations, from flip-chip to direct die attach for multi-die applications to meet the requirements of Heterogeneous Integration (HI) chipsets
- Processing of extra-large substrates up to 600 x 600 mm
- Optional high bond force and temperature capabilities for high-end applications
- High degree of automation with auto material load/unload and tooling change, meeting the SECS/GEM standard
“ASMPT is a pioneer in fan-out packaging technology,” summarizes Nelson Fan. “We can build on our lead in development and technology. With our machines, manufacturers around the world will bring next-generation AI applications to the market.”
To learn more, visit asmpt.com.
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