Next-generation embedded systems are essential for applications in the rapidly evolving connected world. They range from high-performance sensors for capturing critical data to advanced microcontrollers (MCUs) that process and analyze this data. At embedded world 2026, taking place from 10 to 12 March 2026 in Nuremberg, Germany, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) will demonstrate how its innovative semiconductor solutions enable green and efficient energy, clean and safe mobility, and an intelligent and secured IoT. True to the motto “Driving decarbonization and digitalization. Together.” the Infineon booth in Hall 4A, booth 138 will present highlights for applications ranging from AI and IoT to automotive and robotics that contribute to a more sustainable future.
Infineon’s highlight topics at embedded world 2026
Microcontrollers – the core of embedded intelligence: MCUs are the central processing units of modern embedded systems, coordinating control, computation, and connectivity in countless applications. In Nuremberg, Infineon will demonstrate its comprehensive MCU portfolio through live demos that illustrate real-world use cases, such as:
- Edge AI and robotics demonstrations, where Infineon PSOC™ and AURIX™ MCUs enable deterministic real-time processing, adaptive control, advanced safety, and secured connectivity
- Demos targeting software-defined vehicles, including the TRAVEO™ SDV Zonal Demo, highlighting how automotive MCUs support zonal E/E architectures, OTA updates, and software-driven innovation
- Industrial and IoT applications, showing how energy-efficient MCUs combine performance, safety, and cybersecurity to enable smart devices and enable manufacturers to comply with the upcoming European Cyberresilience Act (CRA)
XENSIV™ sensors – bridging the physical and digital worlds: Sensors act as the interface between the real world and digital processing, enabling precise data acquisition for control, monitoring, and decision-making processes. At embedded world 2026, Infineon will present its XENSIV sensor portfolio, demonstrating how sensor data powers advanced systems across automotive, industrial, and consumer electronics. The demos include:
- Robotics and Edge AI demos in which Infineon XENSIV sensors enable robots to see, hear, and feel, providing the environmental and contextual awareness required for safe interaction and autonomous behavior
- Automotive and SDV-related use cases, showcasing how radar, magnetic, and current sensors support perception, monitoring, and zonal architectures in modern vehicles
- IoT and industrial demonstrations including the next generation XENSIV CMOS 60 GHz radar for IoT. These illustrate how MEMS microphones and other XENSIV sensors deliver reliable, high-fidelity data for connected and energy-efficient devices
In addition, Infineon experts will be giving in-depth presentations demonstrating how the company’s MCU and sensor solutions enable efficient, secured, and rapid innovations in areas such as AI, robotics, IoT, and software-defined vehicles. More information on the individual presentations is available at infineon.com/embeddedworld. Recordings of all presentations will be available from March 10 on this page.
Infineon at embedded world
Embedded world will take place in Nuremberg, Germany, from 10 to 12 March, 2026. Infineon will present its products and solutions for decarbonization and digitalization in hall 4A, booth 138. For press inquiries, please contact media.relations@infineon.com. Industry analysts interested in a briefing can email marketresearch.relations@infineon.com.