Electroninks and IDS Cut Aerospace Electronics Manufacturing Time over 70% with New Multi-Material Printing Process

Electroninks, the leader in metal complex inks for additive manufacturing and advanced semiconductor packaging, and Integrated Deposition Solutions (IDS), a developer of aerosol printing systems and process solutions, today announced the results of a joint manufacturing program that slashed production time per device by 73% while achieving near-perfect yield, a milestone that demonstrates aerosol-printed electronics are ready to move from the lab into scaled aerospace production.

Over a three-week qualification run, IDS manufactured more than 100 multilayer printed heaters to strict electrical specifications, a target resistance of 30 ohms within a ±3 ohm tolerance, using a newly created standard operating procedure jointly engineered in cooperation with Electroninks. Every device fell within tolerance, and the companies report manufacturing yield approaching 100%.

“This result is proof of what’s possible when materials science is engineered specifically for manufacturability, not just performance in a lab setting. Our particle-free ink chemistry was built from the ground up to behave predictably at production scale, and that’s exactly what this new proprietary process proves,” stated Mike Torre of Electroninks. “We’re not just supplying ink to the printed electronics industry; we’re redefining what aerospace manufacturers can expect from direct-write processes. This is the kind of innovation that moves printed electronics out of the prototype phase and into mission-critical production faster.”

Printed electronics have long promised lighter, more flexible, more customizable circuitry for aerospace systems, but inconsistent yield and manufacturability have kept many programs stuck in prototyping. This collaboration tackles that gap directly, pairing Electroninks’ particle-free conductive and dielectric materials with IDS’s aerosol platforms to create a workflow precise and repeatable enough for qualification-grade production.

Key technical advances driving the results include:

A fully on-platform process. Electroninks’ UV-curable polyimide (insulation/encapsulation) and EI-615 silver (conductive layer) were both cured and processed directly on the printing system, eliminating external oven steps and the cycle time and variability they introduce.

Low-temperature compatibility. EI-615’s low-temperature processing held substrate temperatures to a maximum of 120°C, widening the range of aerospace-grade substrates the process can support.

A scalable pre-batching methodology. A standardized material pre-batching approach, built into the SOP, simplifies technology transfer from engineering teams to production technicians, addressing a frequent bottleneck when moving printed electronics from R&D to volume manufacturing.

Major throughput gains. Continued optimization of print paths and production flow drove a 73% reduction in manufacturing time per device over the course of the project.

A streamlined production platform. The NanoJet Gen2 system combines aerosol deposition with integrated process controls in a platform designed to simplify operation and support repeatable manufacturing workflows.

The qualified devices have now entered environmental testing to verify long-term reliability and technology readiness for aerospace operating conditions.

“This project highlights the value of close collaboration between materials developers and process engineers,” said Dov Phillips, sales manager at Integrated Deposition Solutions. “The performance targets required much more than selecting the right materials. Success depended on developing a complete workflow that could consistently deliver repeatable results day after day, operator after operator.”

Looking ahead, Electroninks and IDS are jointly developing the integration of in-situ laser processing with Electroninks’ particle-free silver inks, enabling conductive features to be cured immediately after deposition. The companies say this could further compress cycle times and extend direct-write manufacturing beyond flat substrates, opening the door to functional electronics printed across large or complex three-dimensional surfaces.

“Together, we’re showing that high-performance materials and precision deposition can deliver the production consistency aerospace programs require,” continued Phillips, pointing to the broader implications for next-generation advanced manufacturing across aerospace and industrial markets.

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