High-Resolution 2D & 3D AXI for PCB Reliability

Catch defects early. Ship with confidence.

Automatic X-ray Inspection (AXI) is the industry standard for ensuring solder joint integrity on high-reliability electronic assemblies. By combining 2D and 3D laminographic imaging with CAD-driven programming, Datest validates every solder joint, top and bottom side, against IPC-A-610 standards. Whether troubleshooting failed boards or inspecting high-volume production, AXI delivers precise defect detection and process validation, all while keeping throughput high.

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FOD (Foreign Object Debris)
An unknown metallic object was detected

Voiding
Voiding under micro QFN

Insufficient Solder
Lacking solder, potential open pin

BGA-solder Bridging
Solder bridging at multiple locations

Inspection Systems for the Electronics Industry – Viscom

iX7059 XL 3D CT AXI Inspection System

Advanced AXI Capabilities

From prototypes to production, Datest’s AXI services deliver precise solder joint validation, automated defect detection, and full traceability across every stage of the product lifecycle.

Full Solder Joint Validation

Inspect BGAs, QFNs, and hidden interconnects with slice-by-slice clarity.

CAD-Driven Program Generation

ODB++ and ASCII CAD formats ensure accurate, repeatable inspection.

IPC-A-610 Compliance

Automated algorithms evaluate joints to industry standards.

Snapshot Capture & Archiving

Document defects with annotated images for traceability.

Bonepile & Failure Analysis Support

Quickly identify recurring failure patterns in returned or scrap assemblies.

Scalable from Low to High Volume

Suitable for prototypes, pilot runs, and full-scale manufacturing.

Key Benefits

Early Fault Detection & High Test Coverage

Covers a wide range of defects at the component and board level, ensuring thorough quality control.

Scalable for High-Volume Production and Board Complexity

Designed for mass production environments, ensuring consistent quality and efficiency in large-scale PCB manufacturing. Fixturing techniques adapatable to board complexity, including dual stage, dual-well, pneumatic, x-probe, and JTAG/Boundary Scan.

Fast & Automated Testing Process

Reduces test time compared to manual probing or functional testing, improving throughput in production lines.

Faults Detected

Component Defects

Missing or misaligned components
Incorrect components
Component polarity/orientation issues
Value out of tolerance
Damaged components

Solder Joint Defects

Open solder joints
Solder bridges and shorts
Cold or weak joints
Pin-in-hole connection issues

Circuit Continuity & Netlist Errors

Net opens
Shorts between unrelated nets
Incorrect or missing vias/traces
Functional check
Capacitive & Inductive measurements

Get in touch

To inquire about our AXI testing services services. Complete our online enquiry form or give us a call.

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